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| BACK LZ37C1B LZ37C1B DESCRIPTION The LZ37C1B is a 1/7-type (2.55 mm) solid-state color image sensor that consists of PN photodiodes and CMOS (Complementary Metal Oxide Semiconductor) devices. The sensor further includes a timing generator (TG), a correlated double sampling (CDS) circuit, an auto gain control (AGC) circuit and an analog-to-digital converter (ADC) circuit. With approximately 110 000 pixels (393 horizontal x 299 vertical), the sensor provides a stable digital color image with extremely low power consumption. 1/7-type Color CMOS Image Sensor with 110 k Pixels PIN CONNECTIONS 36-PIN LCC SIGOUT AGND TOP VIEW SIGIN BIAS2 AVDD 36 NC 35 34 33 32 31 30 29 NC BIAS1 ADL AGCOUT ADH CKI CKO STBY NC 1 2 3 4 5 6 7 8 9 Y 15 16 17 D3 D4 D5 NC 18 28 SCLK 27 26 25 24 23 22 21 20 19 OFS CLP NC SDI VD HD DGND CLK D7 DVDD D6 FEATURES * * * * * Progressive scan Square pixel Compatible with CIF standard Number of image pixels : 367 (H) x 291 (V) Number of optical black pixels - Horizontal : 13 front and 13 rear - Vertical : 4 front and 4 rear Pixel pitch : 5.6 m (H) x 5.6 m (V) R, G, and B primary color mosaic filters Image inversion function (horizontally and/or vertically) Available for two types of power save mode - AGC and AD circuits become power-off with serial data. - All circuits become power-off with STBY pin Analog output and 8-bit digital output Variable gain control (3 to 30 dB) Variable electronic focal plane shutter (1/30 to 1/10 000 s) Single +2.8 V power supply Package : 36-pin LCC* (N-LCC036-S425A) IN 1 10 11 12 D0 A 13 D1 DGND DVDD IM (N-LCC036-S425A) * * * P * * * R In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. E L * * * PRECAUTIONS * Refer to "PRECAUTIONS FOR CMOS IMAGE SENSORS". * Leadless Chip Carrier D2 14 R LZ37C1B BLOCK DIAGRAM HD, VD CLK DATA TG AGC CONTROL 8-BIT D/A P R E L IM ANALOG VIDEO OUT IN 2 AGC OUT A CMOS IMAGE SENSOR AGC R 8-BIT A/D Y DIGITAL VIDEO OUT LZ37C1B PIN DESCRIPTION PIN NO. SYMBOL 1 NC 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 BIAS1 ADL AGCOUT ADH CKI CKO STBY NC DVDD DGND D0 D1 D2 D3 D4 D5 NC D6 DVDD D7 CLK DGND HD VD SDI NC SCLK CLP OFS BIAS2 I/O - - - O - I O I - - - O O O O O O - O - O O - I I I - I - - - A/D - Analog Analog Analog Analog Digital Digital Digital - Digital Digital Digital Digital Digital Digital Digital Digital - Digital Digital Digital Digital Digital Digital Digital Digital - Digital DESCRIPTION No connection Analog bias voltage 1 for image sensor Bottom ADC reference voltage AGC output Top ADC reference voltage Clock input for oscillator (9.0 MHz) Clock output for oscillator Standby control mode* No connection Digital power supply Digital ground ADC signal output (LSB) ADC signal output ADC signal output ADC signal output ADC signal output ADC signal output No connection ADC signal output Digital power supply ADC signal output (MSB) Clock output (9.0 MHz) Digital ground Horizontal drive pulse input Vertical drive pulse input E R Analog Analog Analog Analog Analog Analog Analog - P SIGOUT SIGIN AGND O I - - - AVDD NC * Standby mode functions High level : Standby mode (all circuits power-off), Low level or open : Normal mode (all circuits active) L Control data input (AGC gain, offset, shutter control, image inversion, etc.) No connection Shift clock for SDI Analog bias voltage for clamp circuit Offset bias voltage for AGC output Analog bias voltage 2 for image sensor Analog image signal output Analog image signal input Analog ground Analog power supply No connection IM 3 IN A R Y LZ37C1B ABSOLUTE MAXIMUM RATINGS PARAMETER Power supply voltage Input signal voltage Storage temperature SYMBOL VDD VO TSTG RATING -0.3 to +4.6 (TA = +25 C) UNIT V V C -0.3 to VDD + 0.3 -40 to +80 RECOMMENDED OPERATING CONDITIONS PARAMETER Power supply voltage Operating temperature Oscillation frequency Digital input voltage Analog input voltage Analog bias voltage LOW level HIGH level SYMBOL VDD TOPR fCK VOL VOH MIN. 2.6 -20 0 0.8VDD (Connect to pin through a capacitor) (Connect to GND through a capacitor) TYP. 2.8 +25 9.0 0.2VDD VDD MAX. 3.0 +50 UNIT V C MHz V V NOTE 1. Applied to input pins STBY, HD, VD, SDI and SCLK. 2. Applied to input pin SIGIN. Do not connect to DC directly. 3. Applied to pins BIAS1, BIAS2, OFS, ADL, ADH, CLP. Do not connect to GND directly. P R E L IM 4 IN NOTES : A 3 R 2 1 Y LZ37C1B CHARACTERISTICS (1/30 s progressive scan readout mode) (TA = +25C, Operating conditions : The typical values specified in "RECOMMENDED OPERATING CONDITIONS". Color temperature of light source : 3 200 K, IR cut-off filter (CM-500, 1mmt) is used.) * Measurement point : Analog image signal output (pin No.32), before AGC circuit and AD converter. PARAMETER Standard output voltage Photo response non-uniformity Saturation output voltage Dark output voltage Dark signal non-uniformity Sensitivity (Green channel) Supply current Standby current Vertical line fixed pattern noise SYMBOL VO PRNU VSAT VDARK DSNU R (G) IVDD ISTBY VFPN 160 MIN. TYP. 150 700 2 3 260 11 1 0.5 10 1.1 MAX. 14 400 6 10 UNIT mV % mV mV NOTE 1 2 3 4 5 6 7 8 9 R P R E 1. The average output voltage of G signal under uniform illumination. The standard exposure conditions are defined as when VO is 150 mV. 2. The image area is divided into 10 x 10 segments under the standard exposure conditions. Each segment's voltage is the average output voltage of all pixels within the segment. PRNU is defined by (Vmax - Vmin)/VO, where Vmax and Vmin are the maximum and minimum values of each segment's voltage respectively. 3. The image area is divided into 10 x 10 segments. Each segment's voltage is the average output voltage of all pixels within the segment. VSAT is the minimum segment's voltage under 10 times exposure of the standard exposure conditions. 4. The difference between average output voltage of the image area and that of the OB area, under nonexposure conditions. 5. The image area is divided into 10 x 10 segments under non-exposure conditions. DSNU is defined by (Vdmax - Vdmin), where Vdmax and Vdmin are the maximum and minimum values of each segment's voltage respectively. 6. The average output voltage of G signal when a 1 000 lux light source with a 90% reflector is imaged by a lens of F4, F50 mm. 7. Total current of analog and digital power supplies, in the dark and at the standard load conditions. (Pin No.6 [oscillator] is external input. Pin No.7 is open.) 8. Total current of power supply in standby mode. (Pin No.8 (STBY) is fixed to "H" level and other input pins are fixed to "H" level or "L" level.) 9. One mean horizontal line signal L IM 5 IN A NOTES : Y mV mA A mVp-p mV LZ37C1B PIXEL STRUCTURE OPTICAL BLACK (4 PIXELS) OPTICAL BLACK (13 PIXELS) 367 (H) x 291 (V) OPTICAL BLACK (13 PIXELS) 1 pin OPTICAL BLACK (4 PIXELS) (1, 291) IN R G B G B G B R G R G R G G R G R G G R G R G R B G B G B G G R G R G R COLOR FILTER ARRAY R G R G R G G B G B G B R G R G B R G R A (367, 291) G B G B G B IM G B G R G R G G B G G R G R G R B G B G B G G R G R G R L E R G R G R G R B G B G B G B G B G B G P (1, 1) 6 R R G R G R G G R G R G R (367, 1) Y LZ37C1B TIMING CHART HORIZONTAL PULSE TIMING HD 906 910 01 4 CLK ADOUT (D0-D7) Normal 8 12 16 20 24 28 32 36 40 44 48 52 56 60 64 68 72 76 80 84 889092 361 363 365 367 OB OB Mirror 7 HD 5 3 1 OB OB 104 108 112 116 120 124 128 132 136 140 144 148 152 156 160 164 168 172 176 180 184 188 192 196 200 CLK ADOUT (D0-D7) Normal OB OB 2 Mirror R 4 6 OB OB 366 364 362 360 358 CLK t ADOUT (D0-D7) SYMBOL t IN MIN. 0 15 D20 PHASE RELATIONS BETWEEN DIGITAL OUTPUT (ADOUT) AND CLOCK (CLK) TYP. MAX. UNIT 40 ns IM Offset A D30 * The rising edge of the HD pulse must be between two rising edges of CLK (0) and CLK (1). * The falling edge of the HD pulse must be between two rising edges of CLK (90) and CLK (91). VERTICAL PULSE TIMING VD HD ADOUT (D0-D7) Normal 328 329 330 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 288 289 290 291 OB OB OB OB Mirror L 4 3 2 1 OB OB OB OB E * The rising edge and falling edge of the VD pulse must be in high period of the HD pulses. R SERIAL DATA TIMING (SDI, SCLK) Shutter D38 P AGC D10 D0 SDI SCLK * Data in SDI are taken at the rising edge of SCLK. * Clock frequency of SCLK should be less than 1/2 of that of CLK. * Do not insert the SDI and SCLK pulses between 36H* and 37H*. Refer to "VERTICAL PULSE TIMING". * Refer to "SERIAL DATA INPUTS" for the contents of serial data from D0 to D38. * It means ordinal number of the HD pulse. 7 Y 8 10 SDI, SCLK Forbidden Period OB OB OB OB LZ37C1B SERIAL DATA INPUTS DATA D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 D17 D18 D19 D20 D21 D22 D23 D24 D25 D26 D27 D28 D29 D30 D31 D32 D33 OFS7 (MSB) OFS6 OFS5 OFS4 OFS3 OFS2 OFS1 OFS0 (LSB) SHT8 (MSB) SHT7 SHT6 SHT5 SHT4 SHT3 SHT2 SHT1 Offset level control of ADC (0.9 to 1.5 V) AGC6 (MSB) AGC5 AGC4 AGC3 AGC2 AGC0 (LSB) Not used. (Fix to low level.) NAME Not used. (Fix to low level.) Auto gain control (0 to 20 dB) FUNCTION R SHT0 (LSB) MIRH E L P MIRV SAD1 (MSB) SAD0 (LSB) MAX2 (MSB) MAX1 MAX0 (LSB) LPMD D34 D35 D36 D37 D38 IM 8 Not used. (Fix to low level.) Shutter speed control (Exposure time is 1 to 1/330 frame period.) H : Horizontal mirror inversion image, L : Normal image H : Vertical mirror inversion image, L : Normal image Phase selection of AD clock (Fix to low level.) Selection of fixed gain (3 to 10 dB) H : Power save mode (AGC and AD off), L : Normal mode IN A R Y AGC1 LZ37C1B Setting of Auto Gain Control * One LSB of the gain code represents approximately 0.156 dB. * Nominal gain values at typical codes are shown below. AUTO GAIN CONTROL (dB) 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 D2 L L L L L L L L L L H H H H H H H H H H D3 L L L L L H H H H H L L L L L D4 L L L H H L L L H H L L L H D5 L L H L H L L H L H L L D6 L H H L L L H H L L D7 L H L H L L H D8 L L H H H L L R L H L L H L H L H H L H L H L H H L L H H H L L H D17 L H L L H L H D18 L L H L L H H A H L H H L H L H H D16 L L H L L H H IN H H L L H H H L H H H H H D14 L L H L L H H D15 L H L L H L H IM H Setting of Offset Level R OFFSET LEVEL (V) 0.9 1.0 1.1 1.2 1.3 1.4 1.5 E * One LSB of the offset code represents approximately 0.002 V. * Nominal offset values at typical codes are shown below. D13 L L L H H H H D19 L H L L H L H D20 L H H L L H H P L 9 Y L H H L L L H H H L L H H H LZ37C1B Setting of Shutter Speed * One LSB of the shutter speed code represents 1H, where 1H is the HD pulse period. * Shutter speed values at typical codes are shown below. SHUTTER SPEED (Exposure Time Unit : H) 330 329 328 * 300 * * 200 * * 100 * * 10 * 3 2 1 H H H L L L L H H H L L H L L L L D22 L L L L D23 L L L L D24 L L L L D25 L L L L D26 L L L H D27 L L L H D28 L L L H D29 L L H H D30 L H L L R L L H L L H H L H L L Y H H L H L L L A L L L L L H L IN H L H H H L L L D37 L H L H L H L H L H L H Setting of Fixed Gain FIXED GAIN (dB) 3 4 5 6 7 8 * One LSB of the gain code represents 1 dB. E R P 9 10 L D35 L L L L H H H H IM D36 L L H H L L H H 10 * Insert capacitors more than 10 F between AVDD and AGND and between DVDD and DGND. * Capacitors whose values are not shown must be 0.1 F. (9 MHz) VD D7 D6 DVDD CLK DGND SDI NC HD P 27 18 NC D5 D4 D3 D2 D1 D0 11 10 8 9 NC CKO STBY DGND DVDD Digital Power Supply 17 16 15 14 13 12 26 25 24 23 22 21 20 19 28 29 30 31 32 33 34 35 36 1 NC CKI ADL ADH BIAS1 AGCOUT 2 3 4 5 6 7 CLP OFS R L LZ37C1B SCLK E IM (TOP VIEW) EXAMPLE OF OPERATION CIRCUIT 10 F BIAS2 SIGOUT SIGIN AGND AVDD NC + 11 10 F + Oscillator (9 MHz) IN A R Y Analog Power Supply LZ37C1B LZ37C1B PACKAGE OUTLINES 36 LCC (N-LCC036-S425A) Center of effective imaging area 9.80.1(2) 27 0.880.05 28 A A' Index mark 36 0.50.35 1 Center of die. 9 Center of die 1.90.2 10 1.20.12 10 R0.4TYP. 9 0.6TYP. 1 36 1.27TYP. 19 18 0.7TYP. 0.4TYP. 18 19 R0.15TYP. 27 28 (Unit : mm) 10.80.1 6.280.075 0.50.35 5.40.075 P-1.0TYP. 0.1TYP. Refractive Refractiva index : nd = 1.5 1.050.1 0.70.1 (2) ;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;; 0.04 (1) A A' Rotation error of die : 1.5MAX. (1 : Effective imaging area) (2 : Lid' size) Glass Lid 0.850.025 Package 0.04 (1) CMOS 12 LZ37C1B PRECAUTIONS FOR CMOS IMAGE SENSORS 1. Package Breakage In order to prevent the package from being broken, observe the following instructions : 1) The CMOS image sensor is a precise optical component and the package material is ceramic. Therefore, o Take care not to drop the device when mounting, handling, or transporting. o Avoid giving a shock to the package. Especially when pins are fixed to the socket or the circuit board, small shock could break the package more easily than when the package isn't fixed. 2) When mounting the package on the housing, be sure that the package is not bent. - If a bent package is forced into place between a hard plate or the like, the package may be broken. 3) If any damage or breakage occurs on the surface of the glass cap, its characteristics could deteriorate. Therefore, o Do not hit the glass cap. o Do not give a shock large enough to cause distortion. o Do not scrub or scratch the glass surface. - Even a soft cloth or applicator, if dry, could cause flaws to scratch the glass. 2) When directly handling the device with the fingers, hold the part without pins and do not touch any pin. 3) To avoid generating static electricity, a. do not scrub the glass surface with cloth or plastic. b. do not attach any tape or labels. c. do not clean the glass surface with dustcleaning tape. 4) When storing or transporting the device, put it in a container of conductive material. 3. Dust and Contamination Dust or contamination on the glass surface could deteriorate the output characteristics or cause a scar. In order to minimize dust or contamination on the glass surface, take the following precautions : 1) Handle the CMOS image sensor in a clean environment such as a cleaned booth. (The cleanliness level should be, if possible, class 1 000 at least.) 2) Do not touch the glass surface with the fingers. If dust or contamination gets on the glass surface, the following cleaning method is recommended : o Dust from static electricity should be blown off with an ionized air blower. For antielectrostatic measures, however, ground all the pins on the device before blowing off the dust. o The contamination on the glass surface should be wiped off with a clean applicator soaked in isopropyl alcohol. Wipe slowly and gently in one direction only. - Frequently replace the applicator and do not use the same applicator to clean more than one device. Note : In most cases, dust and contamination are unavoidable, even before the device is first used. It is, therefore, recommended that the above procedures should be taken to wipe out dust and contamination before using the device. 2. Electrostatic Damage As compared with general MOS-LSI, CMOS image sensor has lower ESD. Therefore, take the following antistatic measures when handling the CMOS image sensor : 1) Always discharge static electricity by grounding the human body and the instrument to be used. To ground the human body, provide resistance of about 1 M$ between the human body and the ground to be on the safe side. 13 LZ37C1B 4. Other 1) Soldering should be manually performed within 2 seconds per pin at 400C maximum at the tip of soldering iron. 2) Avoid using or storing the CMOS image sensor at high temperature or high humidity as it is a precise optical component. Do not give a mechanical shock to the CMOS image sensor. 3) Do not expose the device to strong light. For the color device, long exposure to strong light will fade the color of the color filters. 14 |
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